Last week the New Product Introduction (NPI) awards were handed out virtually, and Elsyca CuBE was the big winner in the Plating category.
CIRCUITS ASSEMBLY'S New Product Introduction (NPI) Awards recognize the leading new products for electronics assembly during the past 12 months. Awards are selected by an independent panel of practicing industry engineers, and are presented by CIRCUITS ASSEMBLY. Elsyca was one of the winners.
“Winning the NPI Award is a true recognition by the PCB industry”, said Robrecht Belis, Manager Surface Finishing and PCB at Elsyca. “It clearly illustrates the importance of understanding the impact of a PCB design on final layer thickness!”.
Elsyca CuBE is an innovative technology and the first-ever simulation software that translates a PCB design into a detailed copper layer thickness graph and KPI information. It extends the DFM capabilities and allows to predict and resolve product and production issues before handoff to the fabricators.