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Postdoctoral Researcher 3D interconnects for hybrid system integration

Be a frontrunner in enabling System and Application driven technology optimization for future semiconductor roadmap




Electronics & Engineering

What you will do

System-Technology Co-Optimization (STCO) is an attractive option where scaling at logic cell level will be complemented by scaling at a global system level. STCO involves the system (for example Server, board and CPU/SoC) to be disintegrated, and subsequently reintegrated more densely or efficiently by using imec integration technologies. This can be enabled by leveraging 3D heterogeneous integration, bringing on-board interconnect and components into one package or chip stack. Another option is integrating different types of devices, optimized for different functionality monolithically in a single wafer, e.g. combining power or RF components with scaled dense logic devices.

The fundamental challenge in STCO is to find useful system level modules that can benefit immensely by enablement of novel integration with next generation of logic and memory, resulting in optimization of power, cost and performance for targeted application domains. To explore such an optimization path, a framework needs to be built that can capture the benefits of such technology solutions at a system level –providing further knobs for continuing the scaling path:

  • You will be responsible to build a scalable interconnect architecture and matched memory organization for building big systems with logic, memory and accelerator blocks processed in different layers.
  • You will build models for different 3D interconnect options that can capture the PPAC (Power Performance Area Cost) parameters at a platform level while meeting the targeted specs for interconnect density, bandwidth requirement.
  • You will help the team to define a 3D interconnect strategy to enable hybrid systems proposed by STCO.
  • The broad goal is to have a system simulation framework that can help to explore the benefits of STCO-driven technology solutions at a system level. Parts of the solution exist but no complete framework has become available int he research community yet. It will be crucial to strike the right balance between modeling detail and flexibility. The key components in a system should be modeled, but only to the extent needed to show their interaction and the benefits of new integration technologies. Detailed analysis of specific technological solutions for logic cores, memories and interconnect and I/O is already being done at imec, which can serve as input to this framework. 

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow. 

We are proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a competitive salary with many fringe benefits.

Who you are

  • You have a Ph.D. degree in Electrical or Computer Engineering preferably focusing on the 3D ICs
  • We need your experience with logic synthesis and computer architecture
  • We are looking for your knowledge in 3D interconnects
  • You are aware of traditional memory subsystem organization and next generation of memory technology.
  • We value your experience with industry-standard EDA tools like Cadence/Synopsys, specifically system modeling tools and languages: SystemC, Platform Architect or similar.
  • We are looking for a good team player and your ability to work independently
  • This postdoctoral position is funded by imec through KU Leuven. Because of the specific financing statute which targets international mobility for postdocs, only candidates who did not stay or work/study in Belgium for more than 24 months in the past 3 years can be considered for the position (short stays such as holiday, participation in conferences, etc. are not taken into account).

How can we help?

The Leuven MindGate team is at your disposal for any questions about the Leuven Innovation Region. Do you want to invest, work or study in the region? We can help you find your way.

We also facilitate collaboration and innovation between companies, knowledge institutes and government within the Leuven Innovation Region, and we are happy to guide any of these stakeholders towards innovation.